Item
|
Production capacity
|
Model production capacity
|
Board size
|
20"x40"
|
20"x40"
|
The highest level
|
12
|
12
|
Thickness
|
0.3mm--3.2mm
|
0.2mm--3.2mm
|
The smallest product aperture
|
0.1mm
|
0.1mm
|
Thickness ratio
|
8:1
|
10:1
|
Line width / Line gap(Outer)
|
3.0mil/3.0mil
|
2.5mil/2.5mil
|
3.0mil/2.6mil
|
2.5mil/2.5mil
|
|
Impedance control
|
+(-)10%
|
+(-)5%
|
Bottom copper thickness:
Inside and outside
|
5 OZ / 5 OZ
|
5 OZ / 5 OZ
|
Electroplating thick gold
|
Au 0.8 - 30U"
|
Au 0.8 - 30U"
|
Electroplating thick gold
|
Ni50-200U"
|
Ni 50-300U"
|
Emersion Gold(ENIG)
|
Au 1 - 4U"
|
Au 1 - 4U"
|
Ni 50-200U"
|
Ni 100-300U"
|
|
Green oil thickness
|
0.2mil --1.2mil
|
0.2mil --1.2mil
|
Blue glue thickness
|
4mil / 20mil
|
4mil / 20mil
|
Welcome to THREE START
Manufacturing capacity
Manufacturing capacity
Equipment Exhibition
Equipment Exhibition
PROCESS
PROCESS